Electronic component, connection body, manufacturing method of connection body, connection method of electronic component, cushioning material

摘要

PROBLEM TO BE SOLVED: To improve connection reliability by resolving differential pressure using a heat crimp tool in an electronic component in which an input bump region and an output bump region are arranged along both side edges of a mounting surface opposite to each other.SOLUTION: On a mounting surface 2 connected to a circuit board 10, an output bump region 4 is provided in which output bumps 3 are arrayed along one side 2a of a pair of side edges opposite to each other, and an input bump region 6 is provided in which input bumps 5 are arrayed along the other side 2b of the pair of side edges. On a pressed surface 8 pressed by a crimping tool on the side opposite to the mounting surface 2, a recess 9 is provided which is overlapped with an inter-bump region 7 between the output bump region 4 and the input bump region 6.SELECTED DRAWING: Figure 1