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Probe position inspection apparatus, semiconductor evaluation apparatus and probe position inspection method
Probe position inspection apparatus, semiconductor evaluation apparatus and probe position inspection method
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机译:探针位置检查装置,半导体评价装置以及探针位置检查方法
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摘要
Provided is a probe position inspection device that can inspect with ease and higher precision a position of a probe included in a semiconductor evaluation apparatus. The probe includes an inspection magnetic field producing part that produces a magnetic field corresponding to a contact point with a subject semiconductor apparatus. The probe position inspection device includes: a base part having a front surface that can be contacted by the probe, and including a plurality of magnetic field sensors placed in a plane parallel to the front surface, each of the magnetic field sensors sensing the magnetic field produced by the inspection magnetic field producing part; and an output part electrically connected to the magnetic field sensors, the output part outputting, based on the magnetic field, a signal corresponding to each of the magnetic field sensors.
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