電子デバイスの製造方法、電子デバイス、電子機器、および移動体

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a highly reliable electronic device with excellent mass productivity.;SOLUTION: A method for manufacturing an electronic device 1 includes the steps of: arranging a mask M2 on a first surface 40a of a substrate 4; forming a recess 41 in the substrate 4 by subjecting a portion of the substrate 4 exposed from an opening of the mask M2 to a first etching; removing the mask M2; forming a plurality of step portions 49 by a plurality of times of etching of a side wall 42 of the recess 41; and forming a conductive portion (wiring lines 741 and 751) from a first surface 40a to an inner bottom surface 41a of the recess 41 through the plurality of step portions 49. A crossing angle θ at which a line L connecting the mutually separated ends of a first stepped portion 49a and a second stepped portion 49b adjacent to each other out of the plurality of stepped portions 49 crosses the first surface 40a or the inner bottom surface 41a, satisfies 10 degθ20 deg.;SELECTED DRAWING: Figure 5;COPYRIGHT: (C)2019,JPO&INPIT