半導体発光装置の製造方法及び半導体発光装置

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor light-emitting device, capable of molding a resin in a desired form without requiring a large-sized device.;SOLUTION: A manufacturing method of a semiconductor light emitting device, includes: a step S01 of providing a plurality of step parts onto a substrate so as to define a region surrounding a light emitting element on a mounting surface of the substrate to which the light emitting element is mounted; a step S02 of providing it into the region surrounding the light emitting element on the mounting surface of the substrate by potting a liquid resin raw material so as to cover the light emitting element; and a step S03 of forming a resin body by hardening the liquid resin raw source.;SELECTED DRAWING: Figure 4;COPYRIGHT: (C)2019,JPO&INPIT