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Microcapsule type amine curing agent, curable resin composition, fine chemicals and composition

机译:微胶囊型胺固化剂,可固化树脂组合物,精细化学品和组合物

摘要

PROBLEM TO BE SOLVED: To provide a microcapsule-type amine-based curing agent which secures sufficient curability and usability, and furthermore exhibits excellent storage stability and solvent resistance, and to provide a curable resin composition using the microcapsule-type amine-based curing agent, a fine chemical and a composition.SOLUTION: The microcapsule-type amine-based curing agent is provided that is obtained by micro-encapsulating an amine-based curing agent, and has no exothermic peak having a heat generation quantity of 1 J/g or more in a temperature range from the softening point of the amine-based curing agent-20°C to the softening point+10°C in a DSC (Differential Scanning Calorimetry) measurement of a mixture of the microcapsule-type amine-based curing agent and an epoxy resin.SELECTED DRAWING: None
机译:解决的问题:提供一种微胶囊型胺基固化剂,其确保足够的固化性和可用性,并且还显示出优异的储存稳定性和耐溶剂性,并且提供一种使用该微胶囊型胺基固化剂的可固化树脂组合物。解决方案:提供一种微囊型胺基固化剂,该微囊型胺基固化剂是通过微囊化胺基固化剂而获得的,并且不存在发热量为1 J / g的放热峰。在微胶囊型胺系固化剂的混合物的DSC(差示扫描量热法)测定中,从胺系固化剂的软化点-20℃至软化点+ 10℃的温度范围内。剂和环氧树脂。

著录项

  • 公开/公告号JP6505428B2

    专利类型

  • 公开/公告日2019-04-24

    原文格式PDF

  • 申请/专利权人 旭化成株式会社;

    申请/专利号JP20140246527

  • 发明设计人 大谷 章;相川 一之;高田 義彦;

    申请日2014-12-05

  • 分类号C08G59/50;

  • 国家 JP

  • 入库时间 2022-08-21 12:19:28

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