Substituted nickel plating bath for copper surface treatment, method of producing copper-clad parts using said plating bath and said copper-clad parts

摘要

According to a copper component such as a multi-layer wiring substrate and a lead frame, adhesion between a copper base material and an insulating resin is improved. According to the copper component, nickel plating bath forms a nickel film improving adhesion between the copper base material and a resin material on a surface of the copper base material, and replacement nickel plating bath for copper surface treatment contains a complexing agent without containing a reducing agent and additionally contains a specific hydrophilic polymer compound and a silane coupling agent. The replacement plating bath enables a replacement nickel film to be interposed and enables the copper base material and the insulating resin material to be laminated thereon, thereby significantly improving adhesion between the copper base material and the resin material.