Light-emitting diode filament with a heat-dissipating structure and light-emitting diode filament light bulb using the same

摘要

A light-emitting diode (LED) filament with a heat-dissipating structure includes multiple LED chips, multiple conductive carriers and a package layer. Each conductive carrier takes the form of a metal sheet and the multiple conductive carriers are spaced apart from each other. Each LED chip is commonly carried by and is electrically connected to two of the multiple conductive carriers adjacent to the LED chip. The package layer covers the multiple LED chips and the multiple conductive carriers with two lateral edge portions of each conductive carrier exposed from the package layer. The LED filament is mounted inside a light bulb. Because the multiple conductive carriers are partially exposed from the package layer, heat generated by the multiple LED chips can be dissipated to an ambient environment without affecting lighting efficiency and light output as a result of accumulated heat.