Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

摘要

Due to the high efficiency, light-emitting diodes (LED) filament lamps have become more and more popular alternative to the incandescent lamp. However, the heat generated by the LED chips is traditionally dissipated by relying on the natural convection within lamps, resulting in poor heat dissipation performance for LED filament lamps. A numerical simulation model of the typical LED filament lamp was established to simulate and analyze the heat dissipation and airflow phenomenon of LED filament lamps in this study. In addition, increasing lamp sizes, increasing phosphor diameters, and using finned phosphor layers were considered as optimization measures to improve the heat dissipation performance of LED filament lamps. When these optimization measures are applied, chip junction temperatures are reduced. A reduction of 6.9 °C is seen when the lamp radius is increased from 25 mm to 31 mm. When the phosphor diameter is increased to 4 mm from 2 mm, the junction temperature is reduced by 17.2 °C. Integration of a finned phosphor layer where there are 12 fins at a height of 1 mm and thickness of 0.2 mm in the layer decreased the junction temperature by 10.9 °C. These optimization results provide technical support for the design and manufacture of LED filament lamps, and thermal analysis results provide theoretical support for the promotion of these optimization methods.