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Cable mounting substrate, cable-equipped substrate and method for connecting cables to cable mounting substrate

机译:电缆安装基板,带电缆基板以及将电缆连接到电缆安装基板的方法

摘要

Provided is a cable mounting substrate for mounting plural cables each of which includes a center conductor, an insulation covering the center conductor and an outer conductor covering the insulation. The cable mounting substrate includes a plate-shaped base, a ground pattern that is arranged on the base and electrically connected to the outer conductor, and a solder member that is provided on the ground pattern and is melted to electrically connect and fix the outer conductor to the ground pattern. The solder member includes a recessed portion having a shape along an outer shape of the outer conductor.
机译:提供一种用于安装多条电缆的电缆安装基板,每条电缆包括中心导体,覆盖中心导体的绝缘体和覆盖绝缘体的外导体。电缆安装基板包括:板状的基座;布置在该基座上并与外部导体电连接的接地图案;以及设置在该接地图案上并熔融以电连接并固定外部导体的焊料构件。接地图案。焊料构件包括凹陷部分,该凹陷部分具有沿着外部导体的外形的形状。

著录项

  • 公开/公告号US10290959B2

    专利类型

  • 公开/公告日2019-05-14

    原文格式PDF

  • 申请/专利权人 HITACHI METALS LTD.;

    申请/专利号US201815893788

  • 发明设计人 TAKASHI KUMAKURA;HIDEHARU NAGAI;

    申请日2018-02-12

  • 分类号H01R9/05;H01R43/02;H01B7/02;H01R9/03;H01R12/53;

  • 国家 US

  • 入库时间 2022-08-21 12:15:38

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