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Methods and systems for reducing dislocation defects in high concentration epitaxy processes

机译:减少高浓度外延工艺中位错缺陷的方法和系统

摘要

Semiconductor devices including semiconductor junctions and semiconductor field effect transistors that exploit the straining of semiconductor materials to improve device performance are provided. Also described are methods for making semiconductor structures. Dislocation defect-free epitaxial grown structures that are embedded into a semiconductor base are provided. The epitaxial structures can extend beyond the surface of the semiconductor base and terminate at a faceted structure. The epitaxial structures are formed using a multilayer growth process that provides for continuous transitions between adjacent layers.
机译:提供了包括半导体结和半导体场效应晶体管的半导体器件,其利用半导体材料的应变来改善器件性能。还描述了用于制造半导体结构的方法。提供了嵌入到半导体基底中的无位错无缺陷的外延生长结构。外延结构可以延伸超过半导体基底的表面并终止于多面结构。外延结构使用多层生长工艺形成,该工艺提供了相邻层之间的连续过渡。

著录项

  • 公开/公告号US10332979B2

    专利类型

  • 公开/公告日2019-06-25

    原文格式PDF

  • 申请/专利权人 SHANGHAI HUALI MICROELECTRONICS CORPORATION;

    申请/专利号US201514879057

  • 发明设计人 RUNLING LI;HAIFENG ZHOU;

    申请日2015-10-08

  • 分类号H01L29/66;H01L29/78;H01L29/165;H01L29/08;H01L21/02;

  • 国家 US

  • 入库时间 2022-08-21 12:15:25

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