首页>
外国专利>
Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
展开▼
机译:使用无锡离子银催化剂对基板的通孔和过孔进行化学镀金属处理
展开▼
页面导航
摘要
著录项
相似文献
摘要
Walls of through-holes and vias of substrates with dielectric material are electroless plated with copper using tin-free ionic silver catalysts. Conductive polymers are first formed on the substrates by treating the substrates with a permanganate solution containing complexing anions followed by applying monomers, oligomers or conductive polymers to the substrate to form a conductive polymer coating on the dielectric of the substrate as well as on the walls of through-holes and vias of the substrate. A tin-free ionic silver catalyst is then applied to the treated substrate. Optionally, the tin-free ionic silver catalyst can include a ligand agent to form a coordination entity with the silver ions of the tin-free catalyst. The silver ions of the tin-free catalyst are reduced by the conductive polymer and then an electroless metal copper bath is applied to the treated substrate to copper plate the dielectric and walls of the through-holes and vias of the substrate.
展开▼