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Base plate for heat sink as well as heat sink and IGBT module having the same

机译:散热器基板以及具有该基板的散热器和IGBT模块

摘要

A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180≤S1/S2≤800, and 300≤N650.
机译:提供了用于散热器的基板以及散热器和具有该基板的IGBT模块。基板包括:基板主体,其包括主体部分;以及壳体。第一表面层和第二表面层分别设置在主体部分的两个相对表面上。 N个销钉,其设置在第一表面层上并且彼此间隔开,每个销钉具有固定在第一表面层上的第一端和配置为自由端的第二端,其中第一表面层和N个销钉被配置为了接触冷却剂,将第一表面层的与冷却剂接触的第一部分的面积表示为S 1 ,并且将第一表面层的第二部分与每个销接触的面积表示为S 2 ,其中180≤S 1 / S 2 ≤800,而300≤N<650。

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