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Interface for limiting substrate damage due to discrete failure
Interface for limiting substrate damage due to discrete failure
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机译:用于限制因离散故障而造成的基板损坏的接口
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摘要
An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.
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