Assemblies having shield lines of an upper wiring layer electrically coupled with shield lines of a lower wiring layer

摘要

Some embodiments include an apparatus having first, second, third and fourth wiring tracks. The first and third wiring tracks sandwich the second wiring track therebetween, and the second and fourth wiring tracks sandwich the third wiring track therebetween. A lower-level wiring layer includes a first wiring which has a first portion extending along the second wiring track, a second portion extending along the first wiring track, and a third portion extending along the third wiring track. An upper-level wiring layer includes a second wiring electrically connected to the first wiring and having a fourth portion extending along the third wiring track. The third portion of the first wiring is coupled with the fourth portion of the second wiring.