首页> 外国专利> Assemblies having shield lines of an upper wiring level electrically coupled with shield lines of a lower wiring level

Assemblies having shield lines of an upper wiring level electrically coupled with shield lines of a lower wiring level

机译:具有较高布线水平的屏蔽线与较低布线水平的屏蔽线电耦合的组件

摘要

Some embodiments include an assembly having a first wiring level with a plurality of first shield lines and first signal lines. The first shield lines and first signal lines have first segments extending along a first direction and second segments extending along the first direction and laterally offset from the first segments. The assembly includes a second wiring level below the first wiring level and having a plurality of second shield lines and second signal lines. The second shield lines and second signal lines have third segments extending along the first direction and fourth segments extending along the first direction and laterally offset from the third segments. The fourth segments of the second shield lines extend to under the first segments of the first shield lines and are electrically coupled to the first segments of the first shield lines through vertical interconnects.
机译:一些实施例包括具有第一布线水平的组件,该第一布线水平具有多条第一屏蔽线和第一信号线。第一屏蔽线和第一信号线具有沿着第一方向延伸的第一段和沿着第一方向延伸并且从第一段横向偏移的第二段。该组件包括第二布线层,该第二布线层在第一布线层以下并且具有多条第二屏蔽线和第二信号线。第二屏蔽线和第二信号线具有沿着第一方向延伸的第三段和沿着第一方向延伸并且从第三段横向偏移的第四段。第二屏蔽线的第四段延伸到第一屏蔽线的第一段的下方,并通过垂直互连电连接到第一屏蔽线的第一段。

著录项

  • 公开/公告号US10573592B2

    专利类型

  • 公开/公告日2020-02-25

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US201715663774

  • 发明设计人 MAKOTO SATO;

    申请日2017-07-30

  • 分类号H01L23/528;H01L23/522;

  • 国家 US

  • 入库时间 2022-08-21 11:28:15

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