首页> 外国专利> Bonded structure, method for manufacturing the same, and bonding state detection method

Bonded structure, method for manufacturing the same, and bonding state detection method

机译:接合结构,其制造方法以及接合状态检测方法

摘要

The purpose of the present invention is to provide a bonded structure, a method for manufacturing the same, and a bonding state detection method which are capable of determining whether or not members are bonded together appropriately. A bonded structure 10 includes a laminated sheet 12A, a laminated sheet 12B, an adhesive 14 that bonds the laminated sheet 12A and the laminated sheet 12B together, and a distributed optical fiber 16 sandwiched between the laminated sheet 12A and the laminated sheet 12B. The cross-sectional shape of the distributed optical fiber 16 is deformed in accordance with the bonding state.
机译:本发明的目的在于提供一种接合结构,其制造方法以及接合状态检测方法,其能够确定构件是否适当地接合在一起。粘合结构 10 包括层压板 12 A,层压板 12 B,粘合的粘合剂 14 。层压片材 12 A和层压片材 12 B在一起,并且在层压片材 12 <之间夹有分布式光纤 16 。 / B> A和层压板 12 B。分布光纤 16 的截面形状根据结合状态而变形。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号