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Field effect transistor, memory element and manufacturing method of charge storage structure using paraelectric and ferroelectric material

机译:使用顺电和铁电材料的场效应晶体管,存储元件和电荷存储结构的制造方法

摘要

A field effect transistor, a memory element, and a manufacturing method of a charge storage structure are provided. The memory element includes a plurality of field effect transistors, and each of the field effect transistors includes a substrate, a source region, a drain region, a gate conductive layer, and a charge storage structure. Both the source region and the drain region are located in the substrate and connected to an upper surface of the substrate. The source and drain regions are spaced apart from each other to define a channel region therebetween. The gate conductive layer is disposed over the upper surface and overlaps with the channel region. The charge storage structure disposed between the gate conductive layer and the channel region includes a ferroelectric material and a paraelectric material so that the charge storage structure has better capability of trapping charges and a higher switching speed.
机译:提供了一种场效应晶体管,存储元件以及电荷存储结构的制造方法。该存储元件包括多个场效应晶体管,并且每个场效应晶体管包括衬底,源极区域,漏极区域,栅极导电层和电荷存储结构。源极区和漏极区均位于基板中并连接至基板的上表面。源极区和漏极区彼此间隔开以在它们之间限定沟道区。栅极导电层设置在上表面上方并且与沟道区重叠。设置在栅极导电层和沟道区域之间的电荷存储结构包括铁电材料和顺电材料,从而电荷存储结构具有更好的捕获电荷的能力和更高的开关速度。

著录项

  • 公开/公告号US10403721B2

    专利类型

  • 公开/公告日2019-09-03

    原文格式PDF

  • 申请/专利权人 NUSTORAGE TECHNOLOGY CO. LTD.;

    申请/专利号US201815862093

  • 发明设计人 FU-CHOU LIU;YUNG-TIN CHEN;

    申请日2018-01-04

  • 分类号H01L29/10;H01L29/66;H01L29/51;G11C19/28;G11C11/22;

  • 国家 US

  • 入库时间 2022-08-21 12:13:16

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