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Analysis of silver ion and complexing agent in tin-silver electrodeposition solution

机译:锡银电沉积溶液中银离子和络合剂的分析

摘要

The present disclosure relates to methods of monitoring the concentrations of silver ion and complexing agent in tin-silver (SnAg) electrodeposition solutions, and analysis and process control using such methods. Methods can include adding a precipitating agent to an electrodeposition solution including at least tin ions, silver ions, and complexing agent to cause a reaction between at least a portion of the precipitating agent and substantially all of the silver ions (to precipitate silver ions as a precipitant); adding a metallic salt to the electrodeposition solution to cause a reaction with substantially all of the remaining precipitating agent; measuring the endpoint of the silver ion back titration; further adding metallic salt to cause a further reaction with the complexing agent; and measuring the endpoint of the complexing agent titration.
机译:本公开涉及监测锡-银(SnAg)电沉积溶液中银离子和络合剂的浓度的方法,以及使用这种方法的分析和过程控制。方法可以包括向电沉积溶液中添加一种沉淀剂,该溶液至少包含锡离子,银离子和络合剂,以使至少一部分沉淀剂与基本上所有的银离子之间发生反应(以沉淀出银离子的形式沉淀剂);向电沉积溶液中加入金属盐,使之与基本上所有剩余的沉淀剂反应;测量银离子反滴定的终点;进一步添加金属盐以引起与络合剂的进一步反应;和测量络合剂滴定的终点。

著录项

  • 公开/公告号US10407795B2

    专利类型

  • 公开/公告日2019-09-10

    原文格式PDF

  • 申请/专利权人 ECI TECHNOLOGY INC.;

    申请/专利号US201615353424

  • 发明设计人 VISHAL PAREKH;EUGENE SHALYT;

    申请日2016-11-16

  • 分类号C25D21/12;C25D21/14;C25D3/46;C25D3/60;

  • 国家 US

  • 入库时间 2022-08-21 12:12:29

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