首页> 外国专利> Filament structure and LED light bulb having the same

Filament structure and LED light bulb having the same

机译:灯丝结构及具有该灯丝结构的led灯泡

摘要

An LED filament contains: a light transmissive substrate, at least one LED chip, a first electrode pin, a second electrode pin, a light emitting layer, and a phosphor layer. The phosphor layer packages the at least one LED chip, and the first electrode pin and the second electrode pin expose outside the phosphor layer. The light emitting layer is made of electromagnetic wave material of different radiation waves, the at least one LED chip produces excitation light source to excite the phosphor layer to illumine lights, and a part of the excitation light source of the at least one LED chip excites the light emitting layer to illuminate the lights after passing through the substrate. The part of the excitation light source excites phosphors of the light emitting layer to illuminate the lights toward the LED filament or the light emitting layer absorbs visible lights converted from infrared lights.
机译:LED灯丝包括:透光基板,至少一个LED芯片,第一电极引脚,第二电极引脚,发光层和磷光体层。磷光体层封装至少一个LED芯片,并且第一电极引脚和第二电极引脚暴露在磷光体层的外部。发光层由不同辐射波的电磁波材料制成,至少一个LED芯片产生激发光源以激发磷光体层来照亮光,并且至少一个LED芯片的激发光源的一部分激发发光层穿过基板后照亮光线。激发光源的一部分激发发光层的磷光体,以朝着LED灯丝照射光,或者发光层吸收从红外光转换而来的可见光。

著录项

  • 公开/公告号US10283683B1

    专利类型

  • 公开/公告日2019-05-07

    原文格式PDF

  • 申请/专利权人 BGT MATERIALS LIMITED;

    申请/专利号US201816166138

  • 发明设计人 KUO-HSIN CHANG;CHUNG-PING LAI;

    申请日2018-10-21

  • 分类号C10B49/02;F21K9/90;H01L33/50;F21K9/232;F21K9/235;H01L25/075;

  • 国家 US

  • 入库时间 2022-08-21 12:11:37

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号