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Power module having control substrate mounted above power substrate with control substrate drivers located between the power substrate power transistors
Power module having control substrate mounted above power substrate with control substrate drivers located between the power substrate power transistors
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机译:功率模块,其控制基板安装在功率基板上方,控制基板驱动器位于功率基板功率晶体管之间
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摘要
An electronic device includes a first substrate, a wiring substrate (second substrate) disposed over the first substrate, and an enclosure (case) in which the first substrate and the wiring substrate are accommodated and that has a first side and a second side. A driver component (semiconductor component) is mounted on the wiring substrate. A gate electrode of a first semiconductor component is electrically connected to the driver component via a lead disposed on a side of the first side and a wiring disposed between the driver component and the first side. A gate electrode of a second semiconductor component is electrically connected to the driver component via a lead disposed on a side of the second side and a wiring disposed between the driver component and the second side.
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