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Cyclic deposition etch chemical vapor deposition epitaxy to reduce EPI abnormality

机译:循环沉积蚀刻化学气相沉积外延以减少EPI异常

摘要

A semiconductor substructure with an improved source/drain structure is described. The semiconductor substructure can include an upper surface; a gate structure formed over the substrate; a spacer formed along a sidewall of the gate structure; and a source/drain structure disposed adjacent the gate structure. The source/drain structure is disposed over or on a recess surface of a recess that extends below said upper surface. The source/drain structure includes a first epitaxial layer, having a first composition, over or on the interface surface, and a subsequent epitaxial layer, having a subsequent composition, over or on the first epitaxial layer. A dopant concentration of the subsequent composition is greater than a dopant concentration of the first composition, and a carbon concentration of the first composition ranges from 0 to 1.4 at.-%. Methods of making semiconductor substructures including improved source/drain structures are also described.
机译:描述了具有改进的源极/漏极结构的半导体子结构。所述半导体子结构可以包括上表面;所述下表面可以包括:在衬底上方形成的栅极结构;沿着栅极结构的侧壁形成的间隔物;源极/漏极结构与栅极结构相邻。源极/漏极结构设置在在所述上表面下方延伸的凹槽的凹槽表面之上或上方。源极/漏极结构包括在界面表面之上或之上的具有第一成分的第一外延层,以及在第一外延层之上或之上的具有后续成分的后续外延层。后续组合物的掺杂剂浓度大于第一组合物的掺杂剂浓度,并且第一组合物的碳浓度在0至1.4原子%的范围内。还描述了制造包括改进的源极/漏极结构的半导体子结构的方法。

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