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NON-ROUGHENED CU TRACE WITH ANCHORING TO REDUCE INSERTION LOSS OF HIGH SPEED IO ROUTING IN PACKAGE SUBSTRATE
NON-ROUGHENED CU TRACE WITH ANCHORING TO REDUCE INSERTION LOSS OF HIGH SPEED IO ROUTING IN PACKAGE SUBSTRATE
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机译:非加固型CU轨迹,带有固定件,可减少包装基质中高速IO布线的插入损耗
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摘要
Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a trace disposed on a conductive layer. The semiconductor package has one or more adhesion anchoring points and a plurality of portions on the trace. An adhesion anchoring point is between two portions on the trace. A surface roughness of an adhesion anchoring point is greater than a surface roughness of a portion on the trace. The trace may be a high-speed input/output (HSIO) trace. The semiconductor package may include via pads disposed on each end of the trace, and a dielectric disposed on the trace. The dielectric is patterned to form openings on the dielectric that expose second portions on the trace. The dielectric remains over the portions. The semiconductor package may have a chemical treatment disposed on the exposed openings on the trace to form the adhesion anchoring points.
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