首页> 外国专利> EXTENDED AREA OF SPUTTER DEPOSITED N-TYPE AND P-TYPE THERMOELECTRIC LEGS IN A FLEXIBLE THIN-FILM BASED THERMOELECTRIC DEVICE

EXTENDED AREA OF SPUTTER DEPOSITED N-TYPE AND P-TYPE THERMOELECTRIC LEGS IN A FLEXIBLE THIN-FILM BASED THERMOELECTRIC DEVICE

机译:柔性薄膜热电器件中溅射沉积的N型和P型热电偶的扩展区域

摘要

A thin-film based thermoelectric module includes a flexible substrate, a number of electrically conductive pads disposed on the flexible substrate, and a number of pairs of N-type and P-type thermoelectric legs electrically in contact with one another formed on corresponding electrically conductive pads of the number of electrically conductive pads such that an area of each N-type thermoelectric leg and another area of each P-type thermoelectric leg are each more than an area of the corresponding electrically conductive pad to allow for extension thereof outside the corresponding electrically conductive pad. The flexible substrate is aluminum (Al) foil, a sheet of paper, teflon, plastic, a single-sided copper (Cu) clad laminate sheet, or a double-sided Cu clad laminate sheet, and has a dimensional thickness less than or equal to 25 μm. The thin-film based thermoelectric module is less than or equal to 100 μm in dimensional thickness.
机译:一种基于薄膜的热电模块,包括柔性基板,设置在该柔性基板上的多个导电垫,以及在对应的导电性上形成的彼此电接触的成对的N型和P型热电腿对。多个导电焊盘中的每个焊盘,使得每个N型热电臂的面积和每个P型热电臂的另一个面积均大于相应的导电焊盘的面积,以允许将其扩展到相应的导电外部导电垫。柔性基板是铝(Al)箔,纸,聚四氟乙烯,塑料,单面覆铜(Cu)层压板或双面覆铜层压板,尺寸厚度小于或等于至25μm。基于薄膜的热电模块的尺寸厚度小于或等于100μm。

著录项

  • 公开/公告号US2019296209A1

    专利类型

  • 公开/公告日2019-09-26

    原文格式PDF

  • 申请/专利权人 SRIDHAR KASICHAINULA;

    申请/专利号US201916440963

  • 发明设计人 SRIDHAR KASICHAINULA;

    申请日2019-06-13

  • 分类号H01L35/34;H02S30/20;H02S10/10;H01L35/30;H01L31/054;H01L35/08;H01L35/32;H02S40/44;

  • 国家 US

  • 入库时间 2022-08-21 12:10:04

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