首页> 外国专利> LASER MICROMACHINING WITH TAILORED BURSTS OF SHORT LASER PULSES

LASER MICROMACHINING WITH TAILORED BURSTS OF SHORT LASER PULSES

机译:短脉冲激光打尾的激光微加工

摘要

A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.
机译:一系列激光脉冲束或脉冲串用于微加工目标结构。每个猝发包括具有短于大约1纳秒的时间脉冲宽度的短激光脉冲。一种激光微加工方法,包括产生激光脉冲的脉冲串并调整激光脉冲的脉冲串的包络以处理目标位置。该方法包括通过基于目标位置处的第一特征的处理特性将突发中的一个或多个第一激光脉冲选择性地调整到第一幅度来调整突发包络,以及将突发中的一个或多个第二激光脉冲选择性地调整到突发中来调整突发包络。第二振幅基于目标位置处第二特征的处理特性。该方法还包括将经过幅度调整的激光脉冲突发引导到目标位置。

著录项

  • 公开/公告号US2019299329A1

    专利类型

  • 公开/公告日2019-10-03

    原文格式PDF

  • 申请/专利权人 ELECTRO SCIENTIFIC INDUSTRIES INC.;

    申请/专利号US201916400792

  • 发明设计人 YUNLONG SUN;

    申请日2019-05-01

  • 分类号B23K26/0622;B23K26/40;

  • 国家 US

  • 入库时间 2022-08-21 12:09:25

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