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SELECTIVELY CONTROLLING APPLICATION OF A SELF-ASSEMBLED MONOLAYER COATING ON A SUBSTRATE OF A DEVICE FOR FACILITATING A REDUCTION OF ADVERSE EFFECTS OF SUCH COATING ON THE DEVICE
SELECTIVELY CONTROLLING APPLICATION OF A SELF-ASSEMBLED MONOLAYER COATING ON A SUBSTRATE OF A DEVICE FOR FACILITATING A REDUCTION OF ADVERSE EFFECTS OF SUCH COATING ON THE DEVICE
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机译:自组装单分子膜涂层在设备基体上的选择性控制应用,有助于减少这种涂层对设备的不良影响
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摘要
Selectively controlling application of a self-assembled monolayer (SAM) coating on a substrate of a device is presented herein. A method comprises: forming a material on a first substrate; removing a selected portion of the material from a defined contact area of the first substrate; forming a SAM coating on the material and the defined contact area—the SAM coating comprising a first adhesion force with respect to the material and a second adhesion force with respect to the defined contact area, and the first adhesion force being less than the second adhesion force; removing the SAM coating that has been formed on the material; and attaching the first substrate to the second substrate—the first substrate being positioned across from the second substrate, and the SAM coating that has been formed on the defined contact area being positioned across from a bump stop of the second substrate.
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