首页> 外国专利> METAL-CLAD LAMINATED BOARD, METHOD FOR PRODUCING METAL-CLAD LAMINATED BOARD, RESIN-ATTACHED METAL MEMBER, METHOD FOR PRODUCING RESIN-ATTACHED METAL MEMBER, WIRING BOARD AND METHOD FOR PRODUCING WIRING BOARD

METAL-CLAD LAMINATED BOARD, METHOD FOR PRODUCING METAL-CLAD LAMINATED BOARD, RESIN-ATTACHED METAL MEMBER, METHOD FOR PRODUCING RESIN-ATTACHED METAL MEMBER, WIRING BOARD AND METHOD FOR PRODUCING WIRING BOARD

机译:金属复合板,金属复合板的制造方法,树脂固定金属构件,树脂固定金属构件的制造方法,配线板以及配线板的制造方法

摘要

A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 μmol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 μm or less in ten-point average roughness Rz.
机译:覆金属层压板包括绝缘层和与绝缘层的至少一个表面接触的金属层。绝缘层包括包含聚苯醚和环氧化合物的反应产物的热固性树脂组合物的固化产物。聚苯醚在一个分子中平均具有1.5至2个羟基,并且环氧化合物在一个分子中平均具有2至2.3个环氧基。在覆金属层压板中,反应产物的末端羟基浓度为700μmol/ g以下。金属层包括金属基板和包含钴的阻挡层。阻挡层设置在金属基板上靠近金属层与绝缘层的接触表面的一侧。接触面的十点平均粗糙度Rz为2μm以下。

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