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MICROELECTRONIC PACKAGE CONSTRUCTION ENABLED THROUGH CERAMIC INSULATOR STRENGTHENING AND DESIGN
MICROELECTRONIC PACKAGE CONSTRUCTION ENABLED THROUGH CERAMIC INSULATOR STRENGTHENING AND DESIGN
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机译:通过陶瓷绝缘子加强和设计实现微电子封装结构
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摘要
A semiconductor packaging structure is disclosed. The semiconductor packaging structure includes a heat spreader, a set of at least two leads, and a ceramic insulator. The heat spreader has a thermal conductivity greater than 300 W/m*K. The ceramic insulator has a mean flexural strength that is greater than 500 MPa and so better able to withstand the thermal expansion mismatch between it and the heat spreader. The heat spreader, the set of at least two leads, and the ceramic insulator may also be part of a semiconductor package along with at least one semiconductor device, a wire bond, and a ceramic lid.
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机译:公开了一种半导体封装结构。该半导体封装结构包括散热器,至少两个引线的组以及陶瓷绝缘体。散热器的导热率大于300 W / m * K。陶瓷绝缘子的平均抗弯强度大于500 MPa,因此能够更好地承受其与散热器之间的热膨胀失配。散热器,至少两条引线的集合以及陶瓷绝缘体也可以与至少一个半导体器件,引线键合和陶瓷盖一起成为半导体封装的一部分。
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