A resin system containing:(i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor;(ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and(iii) one or more curing agent(s),wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.展开▼
机译：树脂体系，包含：（i）热固性树脂前体组分，其包含一种或多种官能度至少为3的多官能环氧树脂前体，优选其中所述前体选自三官能环氧树脂树脂前体和/或四官能环氧树脂前体; （ii）热塑性聚酰胺颗粒组分，其中聚酰胺颗粒的熔融温度T < Sub> PA ;和 （iii）一种或多种固化剂，其中选择树脂前体组分，热塑性颗粒和固化剂，使得在树脂体系的固化周期中环氧基质的胶凝在胶凝温度T GEL 下发生。或低于T PA 。
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