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WAFER FOR EXAMINATION AND EXAMINATION METHOD OF ENERGY DISTRIBUTION

机译:检验用晶圆和能量分布的检验方法

摘要

There is provided a wafer for examination that is a wafer for examination with which energy distribution in a region of a light condensing spot of a laser beam with which irradiation is carried out from the upper surface side of a wafer is checked, and is a wafer for examination in which a first metal layer and a second metal layer different in specific heat or a melting point are formed over an upper surface of a wafer. In an examination method of energy distribution, the energy distribution of the laser beam is checked based on a processing mark formed in the first and second metal layers of the wafer for examination.
机译:提供一种检查用晶片,该检查用晶片是检查从晶片的上表面侧照射的激光的聚光点的区域中的能量分布的检查用晶片。用于检查的方法,其中在晶片的上表面上形成比热或熔点不同的第一金属层和第二金属层。在能量分布的检查方法中,基于在用于检查的晶片的第一和第二金属层中形成的处理标记来检查激光束的能量分布。

著录项

  • 公开/公告号US2019061050A1

    专利类型

  • 公开/公告日2019-02-28

    原文格式PDF

  • 申请/专利权人 DISCO CORPORATION;

    申请/专利号US201816107585

  • 发明设计人 SEIICHI SAI;

    申请日2018-08-21

  • 分类号B23K26/03;B23K26/073;B23K26/06;B23K26/359;

  • 国家 US

  • 入库时间 2022-08-21 12:05:55

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