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Connection body, method for manufacturing a connection body, connecting method and anisotropic conductive adhesive agent

机译:连接体,连接体的制造方法,连接方法及各向异性导电粘接剂

摘要

Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body including an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent containing conductive particles; wherein the conductive particles are regularly arranged; and wherein the conductive particles have a particle diameter that is ½ or less than a height of a connecting electrode of the electronic component.
机译:确保电子元器件与电路基板之间的导电,且电路基板或电子元器件的电极的布线间距减小,并防止电子元器件的电极端子之间发生短路。一种连接体,包括通过包含导电性粒子的各向异性导电粘接剂与电路基板连接的电子部件。其中,所述导电颗粒规则排列;其中,导电颗粒的粒径小于电子部件的连接电极的高度的1/2。

著录项

  • 公开/公告号US10175544B2

    专利类型

  • 公开/公告日2019-01-08

    原文格式PDF

  • 申请/专利权人 DEXERIALS CORPORATION;

    申请/专利号US201515112263

  • 发明设计人 SEIICHIRO SHINOHARA;

    申请日2015-01-13

  • 分类号G02F1/1345;H05K3/32;H01B1/22;H01L23/544;H05K1/18;H01L23;

  • 国家 US

  • 入库时间 2022-08-21 12:04:28

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