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Bath for electroplating deposition of Ni-P alloy coating and method for obtaining Ni-P alloy coatings on the difficult-to-bond conductive substrates

机译:Ni-P合金涂层的电镀沉积浴和在难粘接的导电基材上获得Ni-P合金涂层的方法

摘要

The purpose of the notification is to bathe for galvanic deposition of Ni -P alloy coating,aqueous nickel sulfate acid solution II,NMTF and citric acid are characterised by this,contains nickel salt in the form of sulphate converted to metal 15 - -18 g /dm3,phosphorus in the form of NTMF acid with formula 1 in quantity 100 g /dm3 and citric acid in quantity 10 g /dm3. The purpose of the notification is also to obtain the Ni -P alloy coating on hard welding substrates,consisting of its galvanic deposition from baths constituting an aqueous solution of nickel salt,NTMF acid and citric acid characterised by it,galvanic deposition is obtained from a bath consisting of nickel salt in the form of nickel sulphate II converted into metal 65 (85 g /dm3),phosphorus in the form of NTMF (N -tris -methylenephosphonic acid) of formula 1,in quantity 80 - -100 g /dm3 and citric acid in quantity 1%wag. an appropriate mixture of these preparations for pH within 1,5 -7,5;at the current density in range of 1,0 5,5 A /dm2 for a minimum period of five minutes.
机译:通知的目的是对Ni-P合金涂层进行电镀沉积,硫酸镍酸水溶液II,NMTF和柠檬酸的特征在于,包含硫酸盐形式的镍盐,转化为金属15--18 g / dm3,形式为1的NTMF酸形式的磷为100 g / dm3,柠檬酸为10 g / dm3。通报的目的还在于在硬质焊接基材上获得Ni-P合金涂层,包括从构成镍盐,NTMF酸和柠檬酸水溶液的浴中进行电沉积,其特征在于,由硫酸镍II形式的镍盐转化为金属65(85 g / dm3),式1的NTMF(N-三-亚甲基膦酸)形式的磷的铬浴,数量为80--100 g / dm3柠檬酸含量为1%wag。在1.5至7.5 A / dm2的电流密度范围内,这些制剂的适当混合物的pH值应在1.5 -7,5之内,持续至少五分钟。

著录项

  • 公开/公告号PL427186A1

    专利类型

  • 公开/公告日2019-07-29

    原文格式PDF

  • 申请/专利权人 POLITECHNIKA WROCŁAWSKA;

    申请/专利号PL20180427186

  • 发明设计人 ZBIGNIEW MIRSKI;

    申请日2018-09-26

  • 分类号C25D3/12;C23C18/32;

  • 国家 PL

  • 入库时间 2022-08-21 12:01:00

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