首页> 外国专利> METHOD OF PRODUCTION OF A FLUIT EQUIPMENT WITH IMPROVED FLUIT EQUIPMENT AND FLUIT EQUIPMENT FREQUENCY AND FLUIT EQUIPMENT

METHOD OF PRODUCTION OF A FLUIT EQUIPMENT WITH IMPROVED FLUIT EQUIPMENT AND FLUIT EQUIPMENT FREQUENCY AND FLUIT EQUIPMENT

机译:具有改进的排液设备的排液设备的生产方法以及排液设备的频率和排液设备

摘要

A method for manufacturing a device for ejecting a fluid, comprising the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.
机译:一种用于制造用于喷射流体的装置的方法,包括以下步骤:在容纳所述喷射装置的喷嘴的第一半导体晶片中形成第一结构层;以及在所述第一半导体晶片中形成第一结构层。去除第一结构层的选择性部分以形成用于容纳流体的腔室的第一部分;在容纳所述喷射装置的致动器的第二半导体晶片中,去除第二结构层的选择性部分以形成所述腔室的第二部分;将第一和第二半导体晶片耦合在一起,使得第一部分直接面对第二部分,从而形成腔室。第一部分限定腔室的容积的一部分,该部分大于第二部分限定的腔室的容积的相应部分。

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