CORROSION INHIBITOR LAYER FOR COPPER SURFACES ON BONDING SUBSTRATES AND METHOD FOR PROTECTING COPPER SURFACES PROVIDED FOR WIRE BONDING USING SAME

摘要

The invention relates to a bonding substrate having a contact area (4a) consisting of copper or a copper-based alloy for bonding wire (5), the contact area (4a) being covered with a corrosion inhibitor layer which contains a nitrogen-containing aliphate as an active substance and a nitrogen-containing heterocyclic aromatic as a further active substance. According to the invention, the corrosion inhibitor layer contains, without any water content, 5 wt% or more urea derivative or 3 wt% or more triphenyl guanidine or 2 wt% or more tetrazole derivative or 5 wt% or more 1-H-benzotriazole or 5 wt% or more benzimidazole. The invention also relates to an electronic module having such a bonding substrate and to a method for the corrosion protection of surfaces which are provided for wire bonding and consist of copper or a copper-based alloy.