The thermosensitive pressure-sensitive adhesive according to the present invention comprises a base resin (A) having an SP value in the range of 18±2 and a side-chain-crystalline polymer (B) comprising constituent units of a monomer ingredient comprising a (meth)acrylic ester (B1) having a linear C14-30 alkyl group, wherein the side-chain-crystalline polymer (B) has an SP value satisfying relationship (I). The thermosensitive pressure-sensitive adhesive has reduced adhesive force at temperatures not lower than the melting point of the side-chain-crystalline polymer (B).{[SP value of (A)]-2}≤[SP value of (B)]≤{[SP value of (A)]+2}(I)
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