The thermosensitive pressure-sensitive adhesive according to the present invention comprises a base resin (A) and a carboxyl-free, side-chain crystalline polymer (B), wherein the base resin (A) is a copolymer of a monomer mixture comprising a carboxylated, ethylenically unsaturated monomer (A1) and a (meth)acrylic ester (A2) having a C4-7 hydrocarbon group and the carboxyl-free, side-chain crystalline polymer (B) is a polymer including constituent units of a monomer ingredient comprising a (meth)acrylic ester (B1) having a C14-30 linear alkyl group. The thermosensitive pressure-sensitive adhesive decreases in adhesive force in application to polyimide-based adherends, at a temperature which is not lower than the melting point of the carboxyl-free, side-chain crystalline polymer (B).
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