PCB EMBEDDED STACK FOR IMPROVED ELECTRICAL FUNCTIONALITY AND TEST

摘要

Embodiments include device packages and methods of forming the device packages. A device package may have a plurality of dies that are stacked. Each die may have one or more die contacts that are each electrically coupled to at least one die contact of another die with interconnects. For one embodiment, a substrate is disposed adjacent to the dies and has a first set and second set of pads. An encapsulation layer may be deposited over and around the dies, the interconnects, and the substrate. For one embodiment, the second set of pads on the bottom surface of the substrate are exposed. Additionally, the device package may include at least one interconnect having a first and second end, where the first end is connected to one die contact and the second end extends through the encapsulation layer to at least one pad of the first set of pads.