MULTI-CHIP THICKNESS COMPENSATION DEVICE FOR SINGLE-SIDED POLISHING, AND GRINDING DEVICE, AND GRINDING METHOD

摘要

A multi-chip thickness compensation device for single-sided polishing, a grinding device, and a grinding method. The device comprises a carrier (1). Multiple chip accommodation grooves (7) are formed in the carrier (1). Chip carrying cushions (6) and retractable mechanisms (8) are disposed in the chip accommodation grooves (7). A first surface (6-1) of each chip carrying cushion is used for mounting a chip (2) to be ground. A second surface (6-2) of the chip carrying cushion is connected to a retractable end of the corresponding retractable mechanism (8), and can move back and forth under the drive of the retractable end. The carrier (1) is provided with a connector (9) used for connecting the carrier (1) and a grinding head of the grinding device. The grinding device comprises a grinding device body, the grinding head disposed on the grinding device body, and a multi-chip thickness compensation device used for single-sided polishing. The multi-chip thickness compensation device can automatically adjust working surfaces (2-1) of chips to be ground to a same horizontal surface, thereby reducing manpower and material costs. The grinding device and the grinding method simplify process steps.