SUBSTRATE INSPECTION DEVICE, INSPECTION POSITION CORRECTION METHOD, POSITION CORRECTION INFORMATION GENERATION METHOD, AND POSITION CORRECTION INFORMATION GENERATION SYSTEM

摘要

This substrate inspection device 1 comprises: an inspection jig 3 that holds a plurality of probes U, D; a drive mechanism 801 that brings the plurality of probes U, D into contact with a surface of a substrate; a storage unit 86 that pre-stores position correction information which includes multiple combination patterns of the respective conduction states of the probes U, D and in which each combination pattern is associated with displacement information indicating displacement of the inspection jig 3; a conduction state detection unit 82 that moves the inspection jig 3 to a prescribed inspection position and brings, in said inspection position, the probes U, D into contact with the substrate, and detects the respective conduction states of the probes U, D; a displacement information acquisition unit 83 that selects one pattern from the multiple combination patterns on the basis of the detected respective conduction states of the probes and acquires, as a displacement correction amount, the displacement information associated with the selected combination pattern according to the position correction information; and a correction unit 84 that corrects the inspection position on the basis of the displacement correction amount.