SOLDERING RESIN COMPOSITION, RESIN FLUX CORED SOLDER, FLUX COAT SOLDER, AND LIQUID FLUX

摘要

Provided are a soldering resin composition in which wet-spreading properties are improved and which also has exceptional reliability and processability, a resin flux cored solder in which the soldering resin composition is used, a flux coat solder; and a liquid flux. The solder resin composition includes 30-99% by weight of rosin, and 1-40% by weight of: any of a dimer acid that is the reaction product of oleic acid and linoleic acid, a trimer acid that is the reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to the dimer acid that is the reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by adding hydrogen to the trimer acid that is the reaction product of oleic acid and linoleic acid; or the total of two or more of the dimer acid that is the reaction product of oleic acid and linoleic acid, the trimer acid that is the reaction product of oleic acid and linoleic acid, the hydrogenated dimer acid obtained by adding hydrogen to the dimer acid that is the reaction product of oleic acid and linoleic acid, and the hydrogenated trimer acid obtained by adding hydrogen to the trimer acid that is the reaction product of oleic acid and linoleic acid.