首页>
外国专利>
SYSTEM FOR MEASURING FLATNESS OF A WAFER AND METHOD FOR MEASURING FLATNESS USING THE SAME
SYSTEM FOR MEASURING FLATNESS OF A WAFER AND METHOD FOR MEASURING FLATNESS USING THE SAME
展开▼
机译:晶片平整度测量系统和使用平整度测量平整度的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A flatness measuring unit for measuring a flatness parameter value of the standard wafer using the first light and a flatness measuring unit for measuring a flatness value measured by the flatness measuring unit, And a control unit for controlling the intensity of the first light so that the calculated difference is within a predetermined error range, and the reference value is a known flatness parameter value of the standard wafer to be.
展开▼