Disclosed is a SMT rework apparatus for reworking an element mounted on a substrate. The SMT rework apparatus includes: a hot plate generating heat above a certain temperature; a Peltier element thermally connected to the hot plate and having a heating unit and a heat absorbing unit by applying power; a first heat conductor provided between an element direct area on the substrate and the heating unit and heating adhesive elements fixating the element on the substrate; and a second heat conductor provided between an area around the element on the substrate and the heat absorbing unit and decreasing a temperature of the area around the element to be lower than a temperature of the element direct area.;COPYRIGHT KIPO 2019
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