Thin layer bonding method for low temperature bonding

摘要

The present invention relates to a method of bonding a component using a thin film body in which at least two types of metals including a first metal and a second metal are electroplated and, more specifically, to a low-temperature bonding method, comprising: a preparation step of forming or locating the thin film body on a bonding surface of the component; a first pressure step of applying first pressure 1-3 times higher than a weight of the component; a low-temperature heating step of heating up to temperature in which a metal with low melting temperature of the metals is melted; and a second pressure step of applying second pressure of 0.1-10 Mpa. Accordingly, low-temperature bonding is possible, an improved bonding force can be provided, and delamination can be prevented even when reheating is performed at high temperature after the bonding.