Polyimide Film Having Low Dielectric Constant And High Thermal Conductivity

摘要

The present invention provides a polyimide film including 5 to 18 wt% of a thermally conductive filler and 82 to 95 wt% of a base film, based on the total weight of a polyimide film, wherein the base film is produced by imidizing a polyamic acid formed by the reaction of a dianhydride monomer and a diamine monomer, and the thermally conductive filler contains a unidirectional thermally conductive filler and a multidirectional thermally conductive filler while thermal conductivity in the thickness direction of the polyimide film is 0.5 W/m·K or more, and thermal conductivity in the planar direction is 5.0 W/m·K or more.