- REDISTRIBUTION SYSTEM WITH DENSE PITCH AND COMPLEX CIRCUIT STRUCTURES IN MULTI-LAYERED HOMOGENEOUS STRUCTURE AND A METHOD OF MANUFACTURING THEREOF

摘要

An embodiment of the present invention provides a method and a system of manufacturing a redistribution platform. The method of manufacturing a redistribution platform comprises the following steps: providing a substrate; patterning a first layer of a routing trace on the substrate, wherein the first layer of the routing trace includes a conductive material forming a part of a circuit element; semi-curing a first translucent or transparent material around the first layer of the routing trace; testing the first layer of the routing trace; patterning a second layer of the routing trace on the first translucent or transparent material, wherein the second layer of the routing trace includes an additional conductive material which is the same as the conductive material forming a part of the circuit element, and is attached to the conductive material of the first layer of the routing trace; and fully curing the first translucent or transparent material subsequent to the patterning of the second layer of the routing trace.