Method for manufacturing prepreg, laminated board, printed wiring board, coreless substrate, semiconductor package and coreless substrate

摘要

The present invention is a prepreg having a fiber base layer containing a fiber base, a first resin layer formed on one side of the fiber base layer, and a second resin layer formed on the other side of the fiber base layer, The first resin layer is a layer formed by layering a resin composition (I) containing an epoxy resin (A) as a main component of a resin component, and the second resin layer is at least two primary amino groups in one molecule. A prepreg which is a layer formed by layering the amine compound (B) which has a layer, and the resin composition (II) which contains the maleimide compound (C) which has at least 2 N-substituted maleimide group in 1 molecule as a main component of a resin component, It is a manufacturing method of a laminated board, a printed wiring board, a coreless board | substrate, a semiconductor package, and a coreless board | substrate obtained using this prepreg.