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BUBBLE JETTING CHIP LOCAL ABLATION DEVICE AND LOCAL ABLATION METHOD AND INJECTION DEVICE AND INJECTION METHOD

机译:气泡点胶芯片的局部消融装置和局部消融方法以及注射装置和注射方法

摘要

A bubble ejecting chip including an arbitrary number of bubble ejecting portions having the same size bubble ejecting ports and having the same size is manufactured and mass-produced.An electrode formed with a substrate and a bubble spouting portion formed on the substrate, wherein the bubble spouting portion is formed of a conductive material, and an extending portion formed of an insulating photosensitive resin, provided so as to sandwich the electrode and extended from the tip of the electrode And an air gap formed between the extending portion of the insulating portion and the front end of the electrode can be mass produced by manufacturing a bubble jetting chip.
机译:制造并批量生产包括任意数量的具有相同尺寸的气泡喷射口且具有相同尺寸的气泡喷射部的气泡喷射芯片。电极,其形成有基板和形成在基板上的气泡喷射部,其中,气泡喷射部分由导电材料形成,延伸部分由绝缘光敏树脂形成,延伸部分设置成将电极夹在中间并从电极的尖端延伸,并且在绝缘部分的延伸部分和电极之间形成气隙。可以通过制造气泡喷射芯片来大量生产电极的前端。

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