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Temperature control apparatus for wafer cleaning equipment and temperature control method using the same

机译:晶片清洗设备的温度控制装置及使用该温度控制装置的温度控制方法

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature control apparatus for a wafer cleaning apparatus capable of quickly and accurately determining an abnormality detection of a temperature sensor positioned inside a cleaning tank and a temperature control method using the same. The apparatus for controlling temperature of a wafer cleaning apparatus according to the present invention and the method for controlling temperature using the apparatus are characterized in that the measured value of the first temperature sensor provided inside the inner tank and the measured value of the second temperature sensor provided on the transfer robot for transferring the wafer to the inner tank It is possible to judge abnormal operation of the first temperature sensor provided inside the inner tank. In the method of controlling the temperature of the wafer cleaning equipment according to the present invention, the cleaning liquid contained in each of the inner baths is discharged, and then the pure water of the set temperature is supplied to each inner bath, The abnormality of the temperature sensors can be judged.
机译:晶片清洗装置的温度控制装置及其温度控制方法技术领域本发明涉及一种能够快速且准确地确定位于清洗槽内部的温度传感器的异常检测的晶片清洗装置的温度控制装置及其温度控制方法。 。根据本发明的用于控制晶片清洁设备的温度的设备和使用该设备的用于控制温度的方法,其特征在于,设置在内胆内部的第一温度传感器的测量值和第二温度传感器的测量值设置在传送机器人上的用于将晶片传送到内部容器的装置可以判断设置在内部容器内部的第一温度传感器的异常操作。在根据本发明的控制晶片清洁设备的温度的方法中,排放每个内部浴中包含的清洁液,然后将设定温度的纯水供应到每个内部浴中。可以判断温度传感器。

著录项

  • 公开/公告号KR101967053B1

    专利类型

  • 公开/公告日2019-04-08

    原文格式PDF

  • 申请/专利权人 에스케이실트론 주식회사;

    申请/专利号KR20170094514

  • 发明设计人 하세근;

    申请日2017-07-26

  • 分类号H01L21/67;H01L21/02;H01L21/677;

  • 国家 KR

  • 入库时间 2022-08-21 11:48:50

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