CuSCN Hole transporting material layer comprising copper thiocyanateCuSCN and preparation method thereof

摘要

The present invention relates to a layer of a thiocyanate copper (CuSCN) hole transporting material and a method of manufacturing the same, and a method of manufacturing a layer of a thiocyanate copper (CuSCN) hole transporting material of the present invention comprises: It is possible to solve the problem of high cost and low device stability generated when a conventional polymer material is manufactured into a hole transporting material layer by using the hole transporting material as a transporting material and to produce a hole transporting layer by an aerosol spraying method, A high efficiency perovskite solar cell capable of forming a photovoltaic layer, a photoelectric conversion efficiency, a large area, and a continuous process can be manufactured at a lower cost.