首页> 外国专利> UV UV UV CURABLE ADHESIVE SILICONE COMPOSITION UV CURABLE ADHESIVE SILICONE COMPOSITION SHEET OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

UV UV UV CURABLE ADHESIVE SILICONE COMPOSITION UV CURABLE ADHESIVE SILICONE COMPOSITION SHEET OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

机译:UV UV固化胶粘剂组成UV固化胶粘剂表光学半导体器件及其制造方法

摘要

The present invention relates to an LED chip which can be easily handled because it is in a solid or semi-solid state in a non-cured state at room temperature and is capable of uniformly dispersing the phosphor and covering the surface of the LED chip, A UV curable adhesive silicone composition is provided. Resolution (group R 4 is a vinyl or allyl), means (A) R 1 SiO 3/ 2, R 2 2 SiO 2/2, R 3 a R 4 b SiO include (4-ab) / 2 units, R 2 2 SiO 2/2 units is from 5 to 300 resin structure including a mechanism for continuously repeating an organopolysiloxane, (B) R 1 SiO 3 /2, R 2 2 SiO 2/2, R 3 c H d SiO a (4-cd) / 2 contains the units and R 2 2 SiO 2/2 units is 5 organo hydroxy of the resin structure comprising a structure to which 300 continuously repeatedly hydrogen polysiloxane, (C) the vast shaped catalyst , And is a UV curable adhesive silicone composition which is in a solid state or a semi-solid state which is plastic at room temperature in an uncured state.
机译:LED芯片技术领域本发明涉及一种LED芯片,该LED芯片由于在室温下处于非固化状态而处于固态或半固态,并且能够均匀地分散荧光体并覆盖LED芯片的表面,因此能够容易地进行处理,提供了可UV固化的粘合剂硅氧烷组合物。分辨率(R 4 组是乙烯基或烯丙基),表示 (A)R 1 SiO 3 / 2,R 2 2 SiO 2 / 2,R 3 a R 4 b SiO包括(4-ab)/ 2 单元,R 2 2 SiO 2/2 单元为5到300个树脂结构,包括连续重复 有机聚硅氧烷,(B)R 1 SiO 3 / 2,R 2 2 SiO 2/2,R 3 c H d SiO a (4-cd)/ 2 包含单位和R 2 2 SiO 2/2 单元是由树脂结构组成的5个有机羟基,该结构包括300个连续重复聚氢聚硅氧烷,(C)粗大催化剂的结构,一种可固化的或可半固化的可紫外线固化的粘合剂硅氧烷组合物,其在室温下在未固化的状态下为塑料。

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