UV-curable adhesive silicone composition, UV-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same

摘要

A method of manufacturing an optical semiconductor apparatus includes: cutting a UV-curable adhesive silicone composition sheet into small chips; disposing the resulted chip on a surface of an optical semiconductor device; irradiating UV-rays to the chip via a photomask according to lithography; developing an uncured portion of the chip with a solvent; and heat-curing after that. The UV-curable adhesive silicone composition sheet is obtained by forming a UV-curable adhesive silicone composition into sheet-form, the UV-curable adhesive silicone composition including: (A) an organopolysiloxane having a resin structure of R¹SiO_3/2, R²₂SiO_2/2, and R³_aR⁴_bSiO_(4-a-b)/2 units, (B) an organohydrogenpolysiloxane having a resin structure of R¹SiO_3/2, R²₂SiO_2/2, and R³_cH_dSiO_(4-c-d)/2 units, and (C) a photoactive catalyst. The UV-curable adhesive silicone composition is in a plastic solid state or a semi-solid state in an uncured state at room temperature.